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No. |
Thematic Report |
Guest speaker |
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Development of RF and Sensor Technologies and Application Trends in Ceramic Packaging |
Zhou Jirui Deputy Director, Advanced Packaging & Testing Center,ZYICT |
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Empowerment of Key Technologies and Process Integration for HTCC/LTCC Sintering Equipment in Multilayer Co-firing |
Runsheng Du Expert, China Electronics Technology Group Corporation (CETC) / R&D Director, Hefei Hengli Technology |
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Discussion on Ceramic Packaging Housings and Substrate Technologies for Optical Modules |
Shao Jintao Deputy Director The 55th Research Institute of CETC |
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LTCC Packaging Technology |
Junyong Liu Group Expert The 43rd Research Institute of CETC |
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Application of Laser in Precision Cutting of Ceramics |
Chen Hai,General Manager,Shenzhen Guangdao Laser Technology Co., Ltd. |
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Wang Hongyang General Manager Shenzhen Ftr Technologies Co., Ltd. |
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AI empowers cost reduction and efficiency enhancement in HTCC/LTCC ceramic package substrate manufacturing |
Yu Ruiyun Professor, School of Software Director (Division-Level), Office of Information Construction and Network Security Northeastern University |
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High-Reliability Copper-Based LTCC Packaging Solution |
Dou Zhanming Deputy Chief Engineer,China Zhenhua Group Yunke Electronic Co., Ltd. |
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Topic To Be Confirmed |
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