【Invitation】The 5th Ceramic packages（HTCC/LTCC/DPC）Industry Forum（December 24th, East China）

Electronic packaging technology plays a critical role in ensuring the functionality, performance, and reliability of chips. As the foundation of the entire electronic packaging technology, electronic packaging materials are primarily used for electrical interconnection, moisture protection, heat dissipation, mechanical support, and stress relief of chips, aiming to ensure that both the chips and the entire system can operate normally and stably in various complex and changing environments. With the advancement of electronic information technology, electronic components are increasingly evolving toward miniaturization, higher integration, multifunctionality, and enhanced reliability. As a result, electronic systems are becoming more highly integrated with increasing power density, which places ever-higher demands on packaging materials.

Ceramic packaging, with its high dielectric performance, low-loss characteristics, a coefficient of thermal expansion closely matched to that of silicon, and high structural strength, has achieved widespread application in fields such as aerospace, intelligent vehicles, the Internet of Things, unmanned aerial vehicles, and data centers. For example, ceramic packaging can address the thermal challenges of high-speed optical modules, making it suitable for 800G/1.6T optical modules and emerging technologies like CPO. Furthermore, the trend toward larger substrate sizes and higher-density interconnects in 2.5D packaging is accelerating, and traditional organic substrates can no longer meet these demands. Multilayer ceramic substrates, with their high rigidity and low thermal expansion, offer a promising solution for next-generation ultra-large AI chip packaging.

In recent years, the steady growth of industries such as the Internet of Things and new energy vehicles, coupled with the accelerated commercialization of emerging applications including commercial aerospace, low-altitude economy, integrated space-terrestrial information networks, and high-speed optical modules for artificial intelligence data centers, has become a key driver for the development of microwave devices, optical sensors, optical modules, and related sectors. This, in turn, has fueled rapidly growing demand for high-reliability, high-performance ceramic packaging. According to market data from Fortune Business Insights, the global ceramic packaging market was valued at USD 12.11 billion in 2025, is projected to reach USD 12.83 billion in 2026, and is expected to grow to USD 21.14 billion by 2034, representing a compound annual growth rate of 6.44% over the forecast period. The Asia-Pacific region dominates the ceramic packaging market, accounting for 31.54% of the global market share in 2025.

△Main manufacturing processes for ceramic packaging

Currently, ceramic packaging manufacturing technologies include High Temperature Co-fired Ceramic (HTCC), Low Temperature Co-fired Ceramic (LTCC), Direct Plating Copper (DPC), and additive manufacturing technologies such as 3D printing. The materials involved encompass alumina (Al₂O₃), aluminum nitride (AlN), beryllium oxide (BeO), mullite, silicon nitride (Si₃N₄), glass-ceramic composites, conductive metal pastes, and others.

△Review of previous forums

To seize the opportunities presented by the rapidly growing ceramic packaging market, Aibang will host the 5th Ceramic Packaging (HTCC/LTCC/DPC) Industry Forum in East China on December 24, 2026. The forum will focus on new materials, emerging technologies, and innovative applications in the field of ceramic packaging. We sincerely invite industry experts and academic scholars to attend and explore new development pathways together, while jointly uncovering new opportunities for industry growth.

Speakers are welcome to self-nominate or recommend candidates. Topics may be proposed independently. For speaking or booth sponsorship opportunities, please contact Ms. Wen.tel:18126443075（Same as WeChat）

Optical communications, lasers, microwave devices, modules, sensors, packaging and processing, consumer electronics, automotive electronics, and communications enterprises; ceramic packaging, ceramic shells, ceramic substrate manufacturers; material suppliers for alumina, beryllia, aluminum nitride, silicon nitride, glass-ceramic composites, solders, metal pastes (tungsten, molybdenum-manganese, gold, silver, copper), Kovar alloys, and heat sinks; equipment and accessories providers for ceramic powder preparation and formulation, powder mills, bead mills, tape casters, punching machines, printers, screens, stackers, laminators, hot cutters, 3D printing equipment, binder burn-out and sintering furnaces, setter plates, refractories, brazing systems, electroplating, electroless plating, vacuum coating systems, etching equipment, developing equipment, cleaning equipment, die bonders, wire bonders, lid sealers, parallel seam sealers, trim and form machines, marking systems, X-ray inspection, AOI, visual inspection, film thickness testers, helium leak detectors, performance testing and aging test equipment, and automation equipment; as well as research institutes, universities, and academic institutions.

Method 1: Add WeChat

Ms. Wen: 18126443075 (Same as WeChat)
Email: wenxiaoting@aibang.com

Scan the QR code to add WeChat and inquire about event details.

Method 2: Scan the QR code to register online.

Alternatively, copy the link into your browser and complete the WeChat registration.

https://www.aibang360.com/m/100333

 

Note: The fee includes conference admission, conference materials, lunch, and tea breaks, but does not include accommodation. Discounts are available for downstream application end-users, university faculty, and students.

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