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The 6th Ceramic Substrates and Power Semiconductors Industry Forum
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Innovative Embedded Packaging Technology Based on DAB Ceramic Substrates
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江苏富乐华功率半导体研究院有限公司 战略规划部部长 柳珩
Liu Heng Minister of Strategic Planning Department,Jiangsu Ferrotec Semiconductor Technology Co., Ltd.
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面向高压功率模块的无银活性钎焊 (AMB) 覆铜陶瓷基板：材料创新与可靠性研究
Silver-Free Active Metal Brazing (AMB) Copper-Clad Ceramic Substrates for High-Voltage Power Modules: Material Innovation and Reliability Study
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Chen Tianhua Deputy General Manager, Hexcera
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Application of Laser Precision Machining and Welding Processes in High-Reliability Power Device Packaging
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Zhao Jiantao General Manager,Vi Laser Intelligent Equipment Co., Ltd.
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Application of Defect Inspection in Precision Ceramic Manufacturing Processes
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Liu Weisheng Deputy General Manager Shenzhen Heils Union Technology Co., Ltd.
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Silicon Nitride Powder Project via Ammonolysis Method
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Liu Zaixiang General Manager Qingdao Qiaohai Ceramic New Material Technology Co., Ltd.
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Key Technologies and Innovative Applications of DPC Ceramic Substrates for Advanced Packaging
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Wu Zhaohui General Manager,Jiangxi Lattice Grand Advanced Material Technology Co., Ltd.
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Application of PVD Technology on Ceramic Substrates for Packaging
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Xie Bin Professor University of Science and Technology of China (USTC)
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氮化铝材料一站式解决方案 —— 成都旭瓷新材料，赋能高端制造
AlN material one-stop solution —— Chengdu Xuwxin New Materials, empowering high-end manufacturing
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Jiang Min Deputy General Manager / Sales Director Chengdu Xuci New Materials Co., Ltd./Ningxia Beici New Material Technology Co., Ltd.
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引领高可靠氮化硅陶瓷覆铜基板在新能源汽车、光伏储能与工业功率模块的全域创新应用
Leading the Comprehensive Innovative Application of High-Reliability Silicon Nitride Copper-Clad Substrates in New Energy Vehicles, PV Energy Storage, and Industrial Power Modules
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Zhou Xin, General Manager, NANTONG WINSPOWER SEMICONDUCTOR TECHNOLOGY CO., LTD
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卡位国产替代：92 氧化铝陶瓷基板的量产价值与应用前景
Positioning for Domestic Substitution: Mass Production Value and Application Prospects of 92% Alumina Ceramic Substrates
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Pan Zimei Engineer Guangdong Ciyuan Chuangxin Semiconductor Co., Ltd.
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Discussion on the Application of Silver-Coated Copper in Silver Paste for Chip Interconnection
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Li Minggang Professor Central South University
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Research Progress on the Structure of IGBT Devices
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Zhang Jinping Professor University of Electronic Science and Technology of China (UESTC)
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Application of Magnetron Sputtering Deep Hole Coating on Ceramic Substrates
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Guangdong Huicheng Vacuum Technology Co.,Ltd
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Industrialization Progress and Applications of High-Thermal-Conductivity Ceramic Substrates
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Xiang Peng Deputy General Manager & Chief Engineer Yibin Red-star Electronics Co., Ltd.
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High-Reliability DBA Substrate for SiC Chip Packaging
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Liang Chao Deputy General Manager Jiangsu Bree Optronics Co., Ltd.
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