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创新基于DAB陶瓷基板的嵌入式封装技术Innovative Embedded Packaging Technology Based on DAB Ceramic Substrates
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江苏富乐华功率半导体研究院有限公司 战略规划部部长 柳珩Liu Heng Minister of Strategic Planning Department,Jiangsu Fulehua Power Semiconductor Research Institute Co., Ltd.
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面向高压功率模块的无银活性钎焊 (AMB) 覆铜陶瓷基板：材料创新与可靠性研究Silver-Free Active Metal Brazing (AMB) Copper-Clad Ceramic Substrates for High-Voltage Power Modules: Material Innovation and Reliability Study
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江苏瀚思瑞半导体科技有限公司 副总经理 陈天华Chen Tianhua Deputy General Manager, Jiangsu Hansiri Semiconductor Technology Co., Ltd.
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精密陶瓷工艺制程中缺陷检测的应用Application of Defect Inspection in Precision Ceramic Manufacturing Processes
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深圳禾思众成科技有限公司 副总经理 刘伟生Liu Weisheng Deputy General Manager Shenzhen Heils Union Technology Co., Ltd.
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高可靠功率器件封装中的激光精密加工与焊接工艺应用Application of Laser Precision Machining and Welding Processes in High-Reliability Power Device Packaging
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浙江紫宸激光智能装备有限公司 总经理 赵建涛Zhao Jiantao General Manager,Zhejiang Zichen Laser Intelligent Equipment Co., Ltd.
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氨解法氮化硅粉体项目Silicon Nitride Powder Project via Ammonolysis Method
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青岛桥海陶瓷新材料科技有限公司 总经理 刘在翔Liu Zaixiang General Manager Qingdao Qiaohai Ceramic New Material Technology Co., Ltd.
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面向先进封装的DPC陶瓷基板关键技术及创新应用Key Technologies and Innovative Applications of DPC Ceramic Substrates for Advanced Packaging
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江西晶弘新材料科技有限责任公司 总经理 吴朝晖Wu Zhaohui General Manager Jiangxi Jinghong New Materials Technology Co., Ltd.
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引领高可靠氮化硅陶瓷覆铜基板在新能源汽车、光伏储能与工业功率模块的全域创新应用Leading the Comprehensive Innovative Application of High-Reliability Silicon Nitride Copper-Clad Substrates in New Energy Vehicles, PV Energy Storage, and Industrial Power Modules
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南通威斯派尔半导体技术有限公司 总经理 周鑫Zhou Xin, General Manager, Nantong Westphal Semiconductor Technology Co., Ltd.
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卡位国产替代：92 氧化铝陶瓷基板的量产价值与应用前景Positioning for Domestic Substitution: Mass Production Value and Application Prospects of 92% Alumina Ceramic Substrates
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广东瓷源创芯半导体有限公司 工程师 潘梓梅Pan Zimei Engineer Guangdong Ciyuan Chuangxin Semiconductor Co., Ltd.
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PVD技术在封装用陶瓷基板上的应用Application of PVD Technology on Ceramic Substrates for Packaging
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中国科技大学 教授 谢斌Xie Bin Professor University of Science and Technology of China (USTC)
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IGBT器件的结构研究进展 Research Progress on the Structure of IGBT Devices
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电子科技大学 教授 张金平Zhang Jinping Professor University of Electronic Science and Technology of China (UESTC)
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氮化铝材料一站式解决方案 —— 成都旭瓷新材料，赋能高端制造AlN material one-stop solution —— Chengdu Xuwxin New Materials, empowering high-end manufacturing
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成都旭瓷/宁夏北瓷 副总/销售总监 蒋敏Jiang Min Deputy General Manager / Sales Director Chengdu Xuci New Materials Co., Ltd./Ningxia Beici New Material Technology Co., Ltd.
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磁控溅射深孔镀膜在陶瓷基板上的应用Application of Magnetron Sputtering Deep Hole Coating on Ceramic Substrates
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广东汇成真空科技股份有限公司Guangdong Huicheng Vacuum Technology Co.,Ltd
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高导热陶瓷基板产业化进程及应用Industrialization Progress and Applications of High-Thermal-Conductivity Ceramic Substrates
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宜宾红星电子有限公司 副总经理/总工程师 彭翔 Xiang Peng Deputy General Manager & Chief Engineer Yibin Red-star Electronics Co., Ltd.
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议题待定Topic To Be Confirmed
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湖南金博碳素股份有限公司Hunan Jinbo Carbon Co., Ltd.
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芯片互联银浆中银包铜应用的探讨Discussion on the Application of Silver-Coated Copper in Silver Paste for Chip Interconnection
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中南大学 教授 李明钢Li Minggang Professor Central South University
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面向SiC芯片封装用高可靠性DBA基板High-Reliability DBA Substrate for SiC Chip Packaging
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江苏博睿光电股份有限公司 副总经理 梁超Liang Chao Deputy General Manager Jiangsu Bree Optronics Co., Ltd.
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