冈本硝子株式会社与 U-MAP 株式会社联合开发的氮化铝散热基板，其导热系数达 200W/m・K 的产品已通过半导体基板厂商量产认证，即将启动首批出货。
数据中心海量数据运算会造成服务器高热，散热已成为行业核心痛点。为解决该问题，行业正加速落地以光信号替代电信号的光通信（光电融合技术）；而激光器本身属于高发热元器件，保障其稳定运行的激光载片（散热陶瓷基板）需求重要度正快速提升。
本次完成量产认证的氮化铝基板导热系数高达 200W/m・K，主要用作数据中心激光器（LD）的载片基板。冈本硝子株式会社同步推进更高导热系数 230W/m・K 产品、0.1mm 超薄散热基板的研发，持续以自研陶瓷产品助力行业解决各类热管理难题。
此外，针对更高阶散热需求，230W/m・K 导热基板与 0.1mm 超薄基板现已对外提供样品，下游客户正开展产品前期验证评估。
原文链接：https://www.nikkei.com/nkd/disclosure/tdnr/20260717595538/
推荐活动一：【展会同期论坛】陶瓷基板暨功率半导体产业论坛（8月26日·深圳）
（议题更新至7月17日）
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Thematic Report |
Guest speaker |
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Innovative Embedded Packaging Technology Based on DAB Ceramic Substrates |
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Silver-Free Active Metal Brazing (AMB) Copper-Clad Ceramic Substrates for High-Voltage Power Modules: Material Innovation and Reliability Study |
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Application of Defect Inspection in Precision Ceramic Manufacturing Processes |
深圳禾思众成科技有限公司 副总经理 刘伟生 |
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Application of Laser Precision Machining and Welding Processes in High-Reliability Power Device Packaging |
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Silicon Nitride Powder Project via Ammonolysis Method |
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Key Technologies and Innovative Applications of DPC Ceramic Substrates for Advanced Packaging |
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Leading the Comprehensive Innovative Application of High-Reliability Silicon Nitride Copper-Clad Substrates in New Energy Vehicles, PV Energy Storage, and Industrial Power Modules |
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Positioning for Domestic Substitution: Mass Production Value and Application Prospects of 92% Alumina Ceramic Substrates |
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Application of PVD Technology on Ceramic Substrates for Packaging |
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Research Progress on the Structure of IGBT Devices |
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Application and Development of High-Performance Aluminum Nitride Ceramics |
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Application of Magnetron Sputtering Deep Hole Coating on Ceramic Substrates |
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Industrialization Progress and Applications of High-Thermal-Conductivity Ceramic Substrates |
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Topic To Be Confirmed |
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Discussion on the Application of Silver-Coated Copper in Silver Paste for Chip Interconnection |
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High-Reliability DBA Substrate for SiC Chip Packaging |
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