【邀请函】第二届半导体陶瓷产业论坛（10月31日·无锡）

随着全球晶圆厂持续扩产，全球半导体设备及零部件市场规模保持快速增长，半导体设备精密零部件是半导体行业核心技术的直接保障，由于陶瓷具有高硬度、高弹性模量、高耐磨、高绝缘、耐腐蚀、低膨胀等优点，可用作多种半导体设备的零部件，据统计，在半导体设备零部件中先进陶瓷的价值占比约16%，未来晶圆厂扩产持续需求加速，有望带动陶瓷零部件需求稳定提升。

With the continuous expansion of global wafer fab capacity, the market size for semiconductor equipment and components worldwide is maintaining rapid growth. Precision components for semiconductor equipment serve as a direct safeguard for core technologies in the semiconductor industry. Due to the advantages of ceramics—such as high hardness, high elastic modulus, high wear resistance, high insulation, corrosion resistance, and low thermal expansion—they can be used as components in various semiconductor equipment. According to statistics, advanced ceramics account for approximately 16% of the value among semiconductor equipment components. As the ongoing expansion of wafer fabs accelerates demand, ceramic components are expected to see a steady increase in demand.

据SEMI报告预测，2026年全球半导体设备总销售额预计将达到创纪录的1390亿美元。晶圆厂设备细分市场（包括晶圆加工、掩模版/光罩和晶圆厂设施设备）去年销售额创下 960 亿美元的新高，预计到 2024 年将增长 5.4%，达到 1010 亿美元。后端设备市场预计2024年半导体测试设备销售额将增长13.8%，达到71亿美元，而组装和封装（A&P）设备销售额预计将增长22.6%，达到49亿美元，测试设备销售额在2025年和2026年分别将增长14.7%和18.6%，而A&P设备销售额预计在2025年将增长16%，2026年将增长23.5%。后端设备市场的增长得益于高性能计算半导体器件日益复杂的需求，以及移动、汽车和工业终端市场需求的预期增长。

△图源：SEMI 

半导体设备由腔室内和腔室外设备组成，陶瓷零部件大部分用在离晶圆更近的腔室内，属于核心关键零部件，适用于硅片抛光机、热处理设备（外延/氧化/扩散）、光刻机、沉积设备、半导体刻蚀设备、离子注入机等各种半导体设备的零部件，技术壁垒和加工难度非常高。

表：半导体工艺中使用的不同陶瓷组件

常见的半导体陶瓷材料有氧化铝、氮化硅、氮化铝、碳化硅等，氧化铝（Al₂O₃）高绝缘性、低成本，适用于绝缘部件和承载盘；氮化铝（AlN）高导热性（≈170 W/m·K），用于散热基板和加热器；碳化硅（SiC）耐高温（＞1600℃）、抗等离子侵蚀，适用于刻蚀机部件；氧化钇（Y₂O₃）抗等离子腐蚀，用于刻蚀反应室内衬；氮化硅（Si₃N₄）高强度、耐热冲击，适用于支撑件和机械部件。

According to SEMI reports, global semiconductor equipment sales are projected to reach a record-breaking

先进陶瓷材料结构零部件的同行业企业中，京瓷集团、日本碍子、日本特殊陶业、摩根先进材料、CeramTec、CoorsTek等发展历史悠久，技术实力等均居于全球领先地位，当前国内公司在特定产品开发和产业化以及大规模生产制造能力等方面与国外领先厂商仍有较大或一定差距，在部分产品线的部分核心指标已达到全球主流水平，正逐步实现突破。国内多家厂商积极布局如静电卡盘和陶瓷加热盘等高端陶瓷零部件产品，以加速高端陶瓷零部件的产业化。据悉，目前国内半导体结构陶瓷零部件市场国产化率仅19%。其中，国内高端陶瓷零部件陶瓷加热器和静电卡盘市场均有约30亿的空间。

为加强半导体陶瓷产业上下游交流联动，艾邦智造将于2025年10月31日在无锡举办《2025年第二届半导体陶瓷产业论坛》，本次研讨的主题将围绕半导体陶瓷的原材料技术、成型技术、加工工艺技术、表面处理技术及金属化技术、检测技术，国内外最新研究进展、未来发展趋势以及应用前景等方面展开，诚挚邀请产业链上下游朋友一起交流，为行业发展助力。

In the field of advanced ceramic structural components, industry peers such as Kyocera Group, NGK Insulators, Nippon Tokushu Togyo (NTK), Morgan Advanced Materials, CeramTec, and CoorsTek boast long-standing histories and globally leading technological capabilities. Currently, domestic companies still face significant or notable gaps compared to international leaders in areas such as specific product development, industrialization, and large-scale manufacturing capabilities. However, breakthroughs are gradually being achieved, with some core indicators of certain product lines reaching mainstream global standards.

Multiple domestic manufacturers are actively expanding into high-end ceramic components like electrostatic chucks and ceramic heating plates to accelerate the industrialization of advanced ceramic parts. It is reported that the localization rate for domestic semiconductor structural ceramic components currently stands at only 19%. Among these, the domestic market for high-end ceramic components—specifically ceramic heaters and electrostatic chucks—each holds a market size of approximately 3 billion CNY.

To strengthen communication and collaboration across the semiconductor ceramic industry chain, Aibang Intelligence will host the "2025 Second Semiconductor Ceramic Industry Forum" in Wuxi on October 31, 2025. The forum will focus on key topics including raw material technology, forming technology, processing techniques, surface treatment and metallization technology, and testing methods for semiconductor ceramics. Discussions will also cover the latest global research advancements, future trends, and application prospects. We sincerely invite professionals from across the industry chain to join us in exchanging insights and driving industry progress.

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