【邀请函】第三届陶瓷封装&微波陶瓷产业论坛（12月11日·成都）

随着5G/6G通信、物联网、人工智能、卫星通信、航空航天及高性能计算技术的飞速发展，微波射频器件正向高频化、小型化、高可靠性方向演进，微波介质陶瓷作为核心基础材料，其性能影响器件的信号传输质量、功耗与集成度，与此同时，陶瓷封装技术因具备优异的热导率、高频稳定性及气密性，成为高功率微波器件的首选解决方案。

With the rapid development of 5G/6G communications, the Internet of Things, artificial intelligence, satellite communications, aerospace, and high-performance computing technologies, microwave and RF devices are evolving toward higher frequencies, miniaturization, and higher reliability. As a core foundational material, the performance of microwave dielectric ceramics affects the signal transmission quality, power consumption, and integration level of these devices. Meanwhile, due to their excellent thermal conductivity, high-frequency stability, and hermeticity, ceramic packaging technologies have become the preferred solution for high-power microwave devices.

陶瓷封装以氧化铝（Al₂O₃）、氮化铝（AlN）等陶瓷材料为核心，为电子芯片提供保护的气密性封装技术，为芯片创造一個长期稳定、隔绝外界水汽和污染等工作环境，尤其适用于高可靠性和恶劣工况，凭借卓越的导热性、与芯片匹配的热膨胀系数、优异的电绝缘性、高机械强度和稳定的化学性能，在众多高端领域不可或缺；相较于成本更低的塑料封装，它性能更优但价格更高；相较于金属封装，它具有天然的绝缘优势。其主要工艺形式包括CDIP、CQFP、CLCC等封装，以及允许集成无源元件的LTCC（低温共烧陶瓷）和HTCC（高温共烧陶瓷）。

Ceramic packaging, primarily utilizing ceramic materials such as alumina (Al₂O₃) and aluminum nitride (AlN), is a hermetic packaging technology that provides protective encapsulation for electronic chips. It creates a long-term stable working environment isolated from external moisture and contaminants, making it particularly suitable for high-reliability applications and harsh operating conditions. Owing to its excellent thermal conductivity, coefficient of thermal expansion matching that of chips, outstanding electrical insulation, high mechanical strength, and stable chemical properties, it has become indispensable in many high-end fields. Compared to lower-cost plastic packaging, it offers superior performance but at a higher price. In contrast to metal packaging, it possesses inherent insulation advantages. Its main process forms include package types such as CDIP, CQFP, and CLCC, as well as LTCC (low-temperature co-fired ceramic) and HTCC (high-temperature co-fired ceramic), which allow for the integration of passive components.

微波介质陶瓷（MWDC）是应用于微波频段(主要是UHF、SHF频段，300MHz～300GHz)电路中作为介质材料并完成一种或多种功能的陶瓷，作为一种重要的电子陶瓷材料，微波介质陶瓷具有介电常数高、谐振频率温度系数小、介质损耗低等众多特点。

Microwave Dielectric Ceramics (MWDC) refer to ceramic materials used in microwave frequency circuits (primarily in the UHF and SHF bands, 300 MHz to 300 GHz) as dielectric materials to perform one or more functions. As an important type of electronic ceramics, microwave dielectric ceramics exhibit notable characteristics such as high dielectric constant, low temperature coefficient of resonant frequency, and low dielectric loss.

基于优异的微波介电性能，微波介质陶瓷元器件目前广泛应用于移动通信、卫星通讯、卫星导航与定位、航空航天、电子器件、汽车工业、万物互联等领域。

Owing to their excellent microwave dielectric properties, microwave dielectric ceramic components are now widely used in fields such as mobile communications, satellite communications, satellite navigation and positioning, aerospace, electronic devices, automotive industry, and the Internet of Things. Among these, mobile communications represent a major application area for microwave dielectric ceramic components. 

为加强陶瓷封装&微波陶瓷行业上下游交流联动，艾邦智造将于12月11日在成都举办第三届陶瓷封装&微波陶瓷产业论坛，将围绕陶瓷封装&微波陶瓷创新材料、先进工艺、前沿应用等方面展开，诚挚邀请产业链上下游企业及高校研究所与会交流，共同探讨陶瓷封装&微波陶瓷产业的最新技术进展和未来发展趋势。

此外，艾邦智造与成都旭瓷诚邀您于12月10日前来成都，参观旭瓷工厂，深入厂区了解氮化铝材料一站式整体解决方案。注：参观活动限陶瓷封装、陶瓷覆铜板、LTCC、半导体陶瓷、陶瓷结构件、PCB等类型企业参加。

To enhance communication and collaboration across the ceramic packaging and microwave ceramics industry chain, Aibang Intelligent Manufacturing will host the 3rd Ceramic Packaging & Microwave Ceramics Industry Forum on December 11 in Chengdu. The forum will focus on innovative materials, advanced processes, and cutting-edge applications in ceramic packaging and microwave ceramics. We cordially invite enterprises, universities, and research institutes throughout the industry chain to participate, exchange insights, and jointly explore the latest technological advancements and future development trends in the ceramic packaging and microwave ceramics sector.

In addition, Aibang Smart Manufacturing and Chengdu Xuci sincerely invite you to visit Chengdu before December 10 to tour the Xuci factory and gain an in-depth understanding of one-stop comprehensive solutions for aluminum nitride materials. Note: The visits are limited to companies involved in ceramic packaging, copper-clad ceramics, LTCC, semiconductor ceramics, ceramic structural components, PCBs, and similar types of enterprises.

（1）旭瓷工厂参观活动

2025年12月10日（周三）：14:00-18:00 签到

限陶瓷封装、陶瓷覆铜板、LTCC、半导体陶瓷、陶瓷结构件、PCB等类型企业参加。

*成都旭瓷晚宴酒店地址：四川省成都市新都区三河街道玛歌庄园

参与参观活动报名方式：

温小姐：18126443075（微信同号）

邮箱：wenxiaoting@aibang.com

（2）会议议程

2025年12月11日（周四）：7:30-9:00 签到；8:50-18:00 会议；18:00-20:30 晚宴​

方式一：

温小姐：18126443075（同微信）

邮箱：ab057@aibang.com

扫码添加微信，咨询会议详情

​​Option 1:​​

​​Contact: Ms. Wen​​

​​Tel/WeChat:​​ +86 18126443075

​​Email:​​ ab057@aibang.com

​​Scan the QR code to add WeChat for conference details:​​

注意：每位参会者均需要提供信息

方式二：长按二维码扫码在线登记报名

Note:​​ Each attendee must provide their information.

​​Option 2:​​

​​Long press the QR code to scan and register online:​

或者复制网址到浏览器后，微信注册报名

Copy the URL to your browser and register via WeChat:

https://www.aibang360.com/m/100270?ref=172672

★费用包括会议门票、全套会议资料、午餐、茶歇等，但不包括住宿。