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江丰同芯720万片覆铜陶瓷基板正式投产
近日江丰同芯无锡惠山工厂覆铜陶瓷基板项目正式投产，总投资5亿元、年产720万片半导体芯片先进封装用覆铜陶瓷基板项目，将实现对第三代半导体用覆铜陶瓷基板的国产替代。
此前5月，江丰同芯成功产出第一块“无锡基地”覆铜陶瓷基板，并表示订单已趋于饱和。
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苏奥传感AMB覆铜陶瓷基板部分产品小批量供货
8月8日，苏奥传感发布2026年半年度报告，其中报告中提到在半导体材料领域，AMB覆铜陶瓷基板项目稳步推进，已与多行业应用的众多客户建立联系并向多家企业提供样品，部分产品已进入小批量供货阶段。
推荐活动一：【展会同期论坛】陶瓷基板暨功率半导体产业论坛（8月26日·深圳）
（议题更新至8月8日）
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Thematic Report |
Guest speaker |
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Innovative Embedded Packaging Technology Based on DAB Ceramic Substrates |
Liu Heng Minister of Strategic Planning Department,Jiangsu Ferrotec Semiconductor Technology Co., Ltd. |
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Silver-Free Active Metal Brazing (AMB) Copper-Clad Ceramic Substrates for High-Voltage Power Modules: Material Innovation and Reliability Study |
Chen Tianhua Deputy General Manager, Hexcera |
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Application of Laser Precision Machining and Welding Processes in High-Reliability Power Device Packaging |
Zhao Jiantao General Manager,Vi Laser Intelligent Equipment Co., Ltd. |
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Application of Defect Inspection in Precision Ceramic Manufacturing Processes |
Liu Weisheng Deputy General Manager Shenzhen Heils Union Technology Co., Ltd. |
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Silicon Nitride Powder Project via Ammonolysis Method |
Liu Zaixiang General Manager Qingdao Qiaohai Ceramic New Material Technology Co., Ltd. |
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Key Technologies and Innovative Applications of DPC Ceramic Substrates for Advanced Packaging |
Wu Zhaohui General Manager,Jiangxi Lattice Grand Advanced Material Technology Co., Ltd. |
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Application of PVD Technology on Ceramic Substrates for Packaging |
Xie Bin Professor University of Science and Technology of China (USTC) |
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AlN material one-stop solution —— Chengdu Xuwxin New Materials, empowering high-end manufacturing |
Jiang Min Deputy General Manager / Sales Director Chengdu Xuci New Materials Co., Ltd./Ningxia Beici New Material Technology Co., Ltd. |
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Leading the Comprehensive Innovative Application of High-Reliability Silicon Nitride Copper-Clad Substrates in New Energy Vehicles, PV Energy Storage, and Industrial Power Modules |
Zhou Xin, General Manager, NANTONG WINSPOWER SEMICONDUCTOR TECHNOLOGY CO., LTD |
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Positioning for Domestic Substitution: Mass Production Value and Application Prospects of 92% Alumina Ceramic Substrates |
Pan Zimei Engineer Guangdong Ciyuan Chuangxin Semiconductor Co., Ltd. |
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Discussion on the Application of Silver-Coated Copper in Silver Paste for Chip Interconnection |
Li Minggang Professor Central South University |
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Research Progress on the Structure of IGBT Devices |
Zhang Jinping Professor University of Electronic Science and Technology of China (UESTC) |
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Application of Magnetron Sputtering Deep Hole Coating on Ceramic Substrates |
Guangdong Huicheng Vacuum Technology Co.,Ltd |
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Industrialization Progress and Applications of High-Thermal-Conductivity Ceramic Substrates |
Xiang Peng Deputy General Manager & Chief Engineer Yibin Red-star Electronics Co., Ltd. |
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High-Reliability DBA Substrate for SiC Chip Packaging |
Liang Chao Deputy General Manager Jiangsu Bree Optronics Co., Ltd. |
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Topic To Be Confirmed |
KBC Corporation Ltd. |
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